Disclosure Nr.: AccessProof™ Datum: 2018-07-19 |
Interconnect Routing Structure of Stacked FBGA Package Design Enabling Reduction of Parasitic Inductance in Conductive TracesSprache: English
AccessProof™: 2018-07-19
Persistent Identifier: urn:nbn:de:101:1-2018071916404441619261 |
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